Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Tue Apr 24 18:21:30 EDT 2007 | flipit
Hi, The verbiage states lead finish on components and not solder used in assembly. I have found nothing that states that Swatch got an exemption. Although the 650 micron pitch spec seems to have come from the data Swatch presented in their execpti
Electronics Forum | Sat Oct 08 00:49:59 EDT 2005 | Mika
We do the following things: 1.) RoHS PCB:s is marked with a code. This is to identify that the PCB:s itself are RoHS compliant. 2.) If it is a true RoHS PCBA; we put a printed label with a green "texture" on the PCBA. 3.) If it is a mixed PB free/PB;
Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman
I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Mon Mar 06 22:30:12 EST 2006 | mainenetservices
We have a customer transitioning slowly to lead free due to necessity rather than a need to comply i.e. some of their BGAs can only be purchased Pb free only. So for this we would want to produce them a leadfree soldered PCB (not necessarly RoHS comp
Electronics Forum | Wed Apr 18 09:14:17 EDT 2007 | blnorman
For years all our R&D for high temp applications (automotive underhood electronics) has shown that Pb-free, at our max temps, doesn't have the reliability of SnPb. Fortunately, for us, EoLV (End of Life Vehicle) legislation in Europe was enacted bef
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
