Industry News | 2014-08-07 11:41:44.0
Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
Industry News | 2023-10-23 09:36:49.0
SHENMAO America, Inc. is proud to introduce its latest breakthrough in soldering technology, the PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. With its exceptional performance, eco-friendly attributes, and adaptability to a wide range of applications, PF606-P276 boasts a series of remarkable features and benefits that set it apart from conventional solder pastes.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2024-06-10 10:22:35.0
SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.
Industry News | 2021-08-13 12:42:05.0
Indium Corporation introduces Indium 12.8 HF as it continues to develop innovative solder paste solutions to meet customers' current and emerging needs. Indium 12.8 HF is a versatile paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Industry News | 2022-07-31 19:44:07.0
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
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