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ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production
Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier
Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2021-09-15 18:53:20.0
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering.
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Santa Clara, California USA | Maintenance
Coordinator and/or perform preventive maintenance/programming on SMT equipment. Troubleshooting, data analysis, root cause analysis, train SMT machine operators, follow and improve manufacturing processes. Must be familiar with DEK265 Printer, Fuji C
Career Center | Danville, Illinois USA | Production
http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
