New Equipment | Cleaning Agents
AQUANOX® A8831 is a mild formulation that is compatible with stencils and effectively removes all types of solder pastes (water soluble, rosin, and no-clean) from fine pitch apertures. Aquanox A8831 is a low odor cleaner than can be used in open
New Equipment | Cleaning Agents
AQUANOX® A8830 is a mild formulation that does not damage stencils and is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine pitch apertures. AQUANOX A8830 is a low odor cleaner that can be used
New Equipment | Cleaning Equipment
SD600 PCBA Batch Cleaner Features 1、Visualization of the whole process: Cleaning room equipped with visual window, cleaning process be clear at a glance ； 2 、The world‘s largest cleaning baskets: 645mm(L) ×560mm(W) × 200mm(H) 2 lay
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Industry News | 2018-01-28 16:15:48.0
Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-04-03 08:04:48.0
Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-07-24 06:27:57.0
Nihon Superior scheduled to take place Aug. 28-30, 2018 at the Shenzen Convention & Exhibition Center. The company will debut the new SN100CV™ P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2010-09-16 21:40:05.0
FCT Assembly introduces its RMA250 Solder Paste, a new generation rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process.
