New Equipment | Solder Materials
Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most re
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
New Equipment | Solder Materials
Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9
Industry Directory | Manufacturer
Precision Assembly Inc. offers the most Innovative Electronics Contract Manufacturing Services and Solutions (ECMSS) to meet the needs of our customers. Our highly skilled teams have the manufacturing expertise required to meet your needs
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
New Equipment | Solder Materials
ALPHA® EF-Series fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA soldering flux line is unsurpassed in providing wave soldering process solutions. Its alcohol-based fluxes provide excellent w
New Equipment | Cleaning Agents
IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues
New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
New Equipment | Wave Soldering
1. Direct-type board structure, special titanium claw chain transmission, durable; 2. Preheat system using hot air system, temperature control using PID mode, but the automatic adjustment of the voltage phase angle, so that the temperature control ac
