Industry News | 2013-09-13 13:33:38.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2014-02-25 14:11:07.0
The Balver Zinn Group announces that Cobar Solder Products will exhibit at the SMTA Dallas and SMTA Houston Expos.
Industry News | 2014-08-25 12:36:56.0
The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2015-01-27 10:59:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.
Industry News | 2017-11-03 09:46:42.0
The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2016-04-19 05:13:13.0
The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2016-06-22 16:15:35.0
KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2016-11-14 11:44:29.0
Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.
Industry News | 2017-05-09 04:41:07.0
The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
New Equipment | Cleaning Agents
CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea
