Electronics Forum: sac0307 (2)

Cost of Leadfree Solder Bars

Electronics Forum | Tue Jul 31 14:54:30 EDT 2007 | rpadilla

Hello AJ, The previous answers are correct; Sn has seen a spike in price ever since RoHs was implemented. Furthermore, the other alloys that have been used to replace Pb (because of RoHs) have also seen an increase in price. Sadly these material rep

exessive yellow-gold coloring in the solder pot with tin-silver-copper alloy

Electronics Forum | Mon Sep 25 15:32:21 EDT 2023 | joeljacobo

hello colleagues, Hoping that everyone is doing well, I am reaching out to you in the hope that your experience can help me. We have a wave solder with sac0307 alloy and the pot has turned a golden color, at first I thought it was common tin oxidat

Used SMT Equipment: sac0307 (1)

Vitronics 6622CC No-Lead Wave

Vitronics 6622CC No-Lead Wave

Used SMT Equipment | Soldering - Wave

Vitronics 6622CC No-lead wave soldering machine.  Full pot of SAC 0307 no-lead solder. Finger conveyor, foam fluxer, roll out solder pot and floor pan. Clean and in good working condirion. 440 volt, 3 phase.  

Petlock Incorporated

Industry News: sac0307 (9)

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-05-16 16:16:21.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.

Shenmao Technology Inc.

AIM to Showcase NC259 Solder Paste at IPC Midwest

Industry News | 2012-07-25 10:17:38.0

AIM, will highlight its new NC259 Solder Paste

AIM Solder

Technical Library: sac0307 (1)

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Technical Library | 2021-09-08 13:43:56.0

Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.

Budapest University of Technology and Economics

Express Newsletter: sac0307 (1)


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