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Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Technical Library | 2010-07-08 19:56:15.0

As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.

Radiance Technologies

Vitronics Soltec 6622CC Wave Soldering Machine (Pb Free) (2006)

Vitronics Soltec 6622CC Wave Soldering Machine (Pb Free) (2006)

Used SMT Equipment | Soldering - Wave

Vitronics Soltec 6622CC Wave Soldering Machine (Pb Free) (2006) Brand: Vitronics Model: Soltec 6622CC Type: Wave Soldering Machine (Pb Free) Year: 2006 Serial #: 0603804401 Machine Specifications: Top preheat: Zone 2 and 3 top side Calrod

Tekmart International Inc.

Electrovert EPK Gold Wave Solder

Electrovert EPK Gold Wave Solder

Used SMT Equipment | Soldering - Wave

Speedline Technologies Electrovert EPK Gold Wave Solder Machine - just removered from production in working conditon. Currently in production and available now. 11/2005 DOM, 208VAC 3 Phase Power, Reciprocating Spray Fluxer, L to R Board Flow, Heavy D

Assured Technical Service LLC

SAC305 Lead-Free Solder Alloy

SAC305 Lead-Free Solder Alloy

New Equipment | Solder Materials

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t

AIM Solder

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Technical Library | 2007-11-15 15:54:44.0

At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.

Kester

Nihon Superior’s SN100C Wets and Spreads Faster than SAC305

Industry News | 2010-09-01 21:50:50.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.

Nihon Superior Co., Ltd.

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

Lead-Free Wire Solder for Electronic Assembly

Lead-Free Wire Solder for Electronic Assembly

New Equipment | Solder Materials

Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f

Stellar Technical Products

Nihon Superior Releases Video Results for Evaluation of SN100C and SAC305

Industry News | 2010-09-14 17:20:46.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has released a video demonstrating the results of an evaluation comparing the wettability and spreadability of SN100C and SAC305 solder alloys on stranded wire.

Nihon Superior Co., Ltd.

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO

Industry News | 2022-10-11 17:22:18.0

SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.

Shenmao Technology Inc.


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