Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato
I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for
Industry News | 2014-05-27 11:24:56.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation in Dulles, VA.
Industry News | 2014-06-08 14:54:39.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation, Building 1 Auditorium, in Dulles, VA.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
ALPHA® Preforms with solder paste adds solder volume.
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
International Sn3.0Ag0.5Cu (SAC305) is the most popula
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. SMTA International Conference Proceedings Dissolution Rate of Specific Elements in SAC305 Solder Authors : David Hillman, Ross Wilcoxon, Tim Pearson and Paul McKenna Company
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