Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan
thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod
Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef
You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we
Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef
I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe
I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
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