Electronics Forum | Mon Jun 16 14:39:49 EDT 2003 | stepheno
The second one is typical. The important temperature is the temperature of the joint, not the setting of the oven. The oven setting are only important because they determine the temperature of the joint. If you set the oven to 150, that will be th
Electronics Forum | Mon Jun 16 13:57:48 EDT 2003 | James
Could anyone give me a basic profile temperature settings for a conceptronics 7 zone oven and speed? I have the first couple of zones ramped up to get to the soak temperatures. Is this correct or should I start out with low temperatures and graduall
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Tue Jun 24 06:58:53 EDT 2003 | sanjeevc
Hi The temprature for the first zone should be more as the PCB entering the oven from the ambient shop floor temprature needs a higher temp.Next zone could be lower than the first zone.The ramp is a relation of conveyor speed and the temp profile.T
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Tue Jun 24 09:42:52 EDT 2003 | stepheno
The temprature for the first zone should be less as the PCB entering the oven from the ambient shop floor temprature would suffer a thermal shock from a higher temp. Experience must be gained from profiling a board with thermocouples, otherwise you
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
