Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2009-09-18 09:44:06.0
September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2009-01-30 16:57:01.0
RO-VARIO, the new developed reflow and curing oven from Essemtec, offers a unique modularity and flexibility for a number of solder and hardness tasks in the electronics and solar engineering industries. The first ovens were delivered to the customers earlier this month.
Industry News | 2013-10-09 08:35:53.0
SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
Industry News | 2024-01-29 11:06:57.0
KIC announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop. The workshop is scheduled to take place on Wednesday, Feb. 21, 2024, from 8:30 a.m. to 3 p.m. CST at Delta Hotel Menomonee Falls.
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2014-02-17 20:20:58.0
IC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system in Booth #1336 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
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