New Equipment | Solder Materials
Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost imp
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Industry News | 2011-08-01 16:38:05.0
Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.
New Equipment | Solder Materials
AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resista
Industry News | 2018-08-06 05:59:56.0
Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover. The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products.Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.
Industry News | 2010-04-09 21:17:21.0
Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.
Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
Electronics Forum | Fri Jun 06 03:28:52 EDT 2008 | reypal
I've got the same scenario. and I followed SAC105.
Electronics Forum | Thu Sep 18 12:11:45 EDT 2008 | jwentz
Does anyone have experience with using Pb-free SAC105? We are looking at the pro's/con's compared to a SAC305 process for a SMT operation. I have read it has a higher melting temperature. Specifically, we are concerned about a product we are developi
Electronics Forum | Thu Sep 25 16:30:44 EDT 2008 | aj
Hi, I would be interested to hear the outcome of your trials! Although, if mechanical stress is of concern, I would look at what is causing the stress and tackle that. I would suspect that any stress great enough to fracture sAC305 joint would do t
