Full Site - : sac305 solder (Page 6 of 62)

Lead-Free Wire Solder for Electronic Assembly

Lead-Free Wire Solder for Electronic Assembly

New Equipment | Solder Materials

Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f

Stellar Technical Products

Nihon Superior’s SN100C Wets and Spreads Faster than SAC305

Industry News | 2010-09-01 21:50:50.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.

Nihon Superior Co., Ltd.

MULTICORE Solder Wires

MULTICORE Solder Wires

New Equipment | Solder Materials

The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas

Henkel Electronic Materials

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Technical Library | 2020-10-27 02:02:17.0

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.

FCT ASSEMBLY, INC.

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

Nihon Superior Launches Ag-free SAC305 Replacement – SN100CV

Industry News | 2023-01-09 18:39:37.0

With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.

Nihon Superior Co., Ltd.

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

Christopher Associates Debuts Koki SB6N58-A730 Low-Temperature Lead-Free Solder Paste

Industry News | 2010-12-07 15:07:35.0

Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.

Christopher Associates Inc.

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the APEX Hand Soldering Competition

Industry News | 2015-01-27 10:59:31.0

The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.

Balver Zinn

The Balver Zinn Group Proud Sponsor of the Productronica IPC Hand Soldering Competition

Industry News | 2017-11-03 09:46:42.0

The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn


sac305 solder searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
Void Free Reflow Soldering

Software for SMT placement & AOI - Free Download.
thru hole soldering and selective soldering needs

High Throughput Reflow Oven