Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Electronics Forum | Mon Apr 16 11:10:13 EDT 2012 | kkay
We are thinking of switching over from sac305 to sn100. Has anyone had any experience with this changeover and is there any drawbacks to switching to sn100?
Electronics Forum | Tue Apr 17 13:42:06 EDT 2012 | gaz
I'd say it depends on the whole process you have. With our 5 zone oven, I could never get a profile that worked as well as SAC305, so we switched back.
Industry News | 2010-03-22 13:14:36.0
GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.
Industry News | 2014-11-22 07:42:40.0
FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo & Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes.
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
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