Industry News | 2012-06-11 12:58:50.0
Virtual Industries Inc.announces that it will debut the new WV-9000 WAFER-VAC System for handling wafers and solar cells in Booth #2427 South at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Industry News | 2009-04-21 13:02:34.0
Essemtec Switzerland has announced that as of April 2009, its new subsidiary Essemtec Benelux will be responsible for all activities of the Swiss SMT equipment supplier regarding Belgium, Netherlands and Luxembourg. The first official presentation will be at the Electronics & Automation exhibition in Utrecht (27th � 29th of May 2009).
New Equipment | Test Equipment
The Guardian 1010 AC Hipot Tester performs AC dielectric withstand (hipot) tests. The test voltage can be programmed in the range from 50VAC to 5kVAC with a resolution of 1V. The maximum total output current is 30mA. Quick Discharge:In both the DC
New Equipment | Test Equipment
Inline test system for incircuit and functional tests with Teradyne measuring equipment ENGMATEC presented for the first time a test handler with integrated Test Station Inline TSi from Teradyne. On request of the Boston company Teradyne, a test
New Equipment | Rework & Repair Equipment
The Hakko FX-888D is an updated digital version of the popular FX-888 and includes several new features. User selectable preset temperatures and digital calibration simplify user setup and operation, and the new password protection and low temperatur
New Equipment | Rework & Repair Equipment
The FR-810 Hot Air Rework Station sets a new bar for convective rework. The new, compact and lightweight design (only 2.9 lb.) features a quiet, self-contained turbine air supply, capable of delivering approximately 100 L/min (free flowing). The new
Industry News | 2014-02-20 20:04:17.0
Embedded systems in the areas of medical, digital signage, gaming, video conferencing and industrial automation need outstanding CPU and graphics performance but are constrained by either size or thermal management. ADLINK Technology's new offering, the cExpress-HL COM Express® Type 6 Compact size computer-on-module (COM), takes full advantage of the Mobile 4th Generation Intel® Core™ Processor (formerly known as "Haswell-ULT") to provide a compact, high-performance COM solution with outstanding graphics capabilities.
Industry News | 2022-05-03 11:30:37.0
1000BASE-RHC Optical Physical Layer Adds Robust and EMC-safe Network Interface to Communication Gateway ECU
New Equipment | Industrial Automation
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YSPEPCB/FPCPunchingMachineFeature: 1?PCBA Punch Machine is punch mold machine. 2?Equipment,compactstructure,solidbody,cylinderbore125,160,200AirTAC. 3?Equipment running smoothly,low vibration,lownoise. 4?English touch screen display,clear panel,al