Electronics Forum | Mon Jul 14 07:27:06 EDT 2014 | sherine
Hello,my question as below: 1. If the component is black color but the color of PCB is dark green. It seem no different in color between it. Any suitable algorithm can be used on it? 2. Algorithm Mem1-Mem2 make many false error and affect the First P
Electronics Forum | Wed Sep 29 05:30:59 EDT 2010 | patejl
Hi We have a problem here in the company with AOI system, most of the problem is lifted lead on qfp components.We are using SAKI BF-planet-x. Most of the defects like mising components 603 or 402 are no problem but if it comes to lifted lead even
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Industry News | 2016-03-01 13:33:18.0
SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
| https://unisoft-cim.com/prontoaoi.php
Automation, Jutze Technology, Koh Young, Landrex Technologies, Machine Vision Products (MVP), Marantz, MEK, Mirtec, Omron, Orbotech, Parmi, Pemtron, Photon Dynamics, Saki, Samsung, Shanghai Holly, Test Research, Vi Technology, Viscom, ViTrox, YESTech, YesTek, ZhenHuaXing, etc
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