Career Center | Bedford, Texas USA | Engineering,Maintenance,Technical Support
Candidate will travel regional territory fixing, repairing, maintaining, installing PCBA /SMT capital equipment in the Salt Lake City area and surrounding territory. Need a professional with recent and significant SMT experience, good electromechani
Career Center | Salt Lake City, Utah USA | Engineering,Production
This individual will be responsible for designing and implementing processes, procedures, and controls for electronic assembly, including surface mount, hand soldering, and mechanical assembly. Experience with the Mydata surface mounting equipment is
Technical Library | 2013-05-09 14:35:18.0
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2017-11-30 10:29:29.0
Each year the electronics industry is faced with new product designs that call for smaller printed circuit boards (PCBs) to function in more aggressive and rigorous service environments. As demands change, conformal coating is becoming increasingly adopted to ensure PCB reliability in environments where moisture, condensation, dust, dirt, salts, chemicals, abrasion, thermal shock, mechanical shock, and other factors can all affect circuit performance. This guide reviews the benefits of using light-cure conformal coatings as well as cost justification, typical processing guidelines and best practices, product selection criteria, data, and industry specifications.
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
New Equipment | Solder Materials
Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f
Standard: ASTM B338, ASTM B862 Grade: Gr1 Gr2 Gr7 Gr12 Size(mm): OD 10.3~914 WT 0.5~30.96 Length 18000 Titanium and titanium alloy welding pipe, have good strength, hardness, low density light weight,
Standard: DIN912, DIN933, DIN931, DIN7991 etc. Grade: Gr2 Gr5 Gr7 Gr12 etc. Size(mm): M1.2~M24 M24~bigger size Titanium and titanium alloy fasteners, have good strength, hardness, low density, light weight, high temperatur
Career Center | Bedford, Texas USA | Technical Support
Field Engineer for Salt Lake City. Candidate should have 3+ years SMT, PCBA equipment knowledge and be able to travel 60% in the region with a focus on a SL customer. Candidate will be fixing, repairing, programming, installing, etc SMT machines in
