Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
The CoaXPress series cameras operate 72fps with ZERO-ROT function at 8bit/10bit CXP-6 4CH It provides advanced technology of vision solution Sensor : 25MP Color & Mono CMOS Sensor (Global & Rolling Shutter) Resolution : 5,120(H) x 5,120(V) Fram
RCM-H1000D series Desktop automatic centrifugal mixer-temperature recovery type One.piece use clause H1000D desktop automatic centrifugal mixer is based on current technology and safety standards: GB4793.1-2007 "Safety requirements for electrical eq
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sam
Used SMT Equipment | X-Ray Inspection
we are looking for wth following options: Automatic microfocus X-ray inspection system including: - 160 kV proprietary microfocus X-ray source (open design) with “unlimited” lifetime, including demountable collimator for enhanced image qualit
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sample Ma
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Industry News | 2012-12-12 16:15:59.0
IPC Sample Master Ordering Agreement for EMS Companies and OEMs available from IPC — Association Connecting Electronics Industries®.
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
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