Industry News | 2008-02-03 21:37:29.0
San Diego � February 4, 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it is entering its 30th year of business within the electronics industry.
Industry News | 2012-01-19 23:30:49.0
ACD will highlight its off-shore manufacturing services in Booth #1814 at the upcoming IPC APEX Expo.
Industry News | 2012-01-26 22:34:41.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Industry News | 2012-01-30 13:10:55.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will moderate Session S21, titled “Solder Joint Testing and Performance,” at the upcoming IPC APEX conference and exhibition.
Industry News | 2012-03-13 10:31:08.0
SANTA ANA, CA — March 2012 ― Industry-leading solutions provider Christopher Associates Inc. made quite the splash with both exhibitors and attendees at the IPC APEX EXPO 2012 in San Diego, CA (2/28-3/1).
Industry News | 2012-04-02 12:24:27.0
Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND in Booth #346 at the upcoming Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA.
Industry News | 2012-09-05 08:13:47.0
Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Industry News | 2013-01-18 15:17:13.0
LPKF Laser & Electronics will exhibit at the 2013 IPC/APEX Exposition. Situated in booth 2333, LPKF will showcase the MicroLine 1120 P, a compact UV laser system designed for processing bare PCBs.
Industry News | 2013-01-19 05:42:49.0
Through Mould Via (TMV) is referred to as a second generation package on package device developed by AMKOR and incorporated into many of the leading mobile devices. The process of assembly provides some challenges event to those using the traditional PoP devices.
Industry News | 2013-02-12 12:25:53.0
MYDATAis scheduled to release new models of its popular SMD Tower for compact storage of electronics manufacturing components.
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