Industry News | 2023-01-30 16:10:55.0
StenTech® Inc. received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2023-01-30 16:29:36.0
Insituware LLC is pleased to announce that it presented the 2023 Top Hat Awards to the top three reps of the year during the recent 2023 IPC APEX EXPO in San Diego. The criteria for the Top Hat Awards include product line launch support, sales performance, and tenaciousness.
Industry News | 2023-01-30 16:52:48.0
Europlacer has taken the top slot in the placement equipment Accessory Technologies category for its Intelligent Freeform Feeder at the prestigious Circuits Assembly NPI Awards, presented at the IPC APEX Expo 2023 in San Diego.
Industry News | 2023-01-30 16:58:43.0
StenTech® Inc. debuted its newly refreshed branding during the recent 2023 IPC APEX EXPO at the San Diego Convention Center in California. Along with featuring their unique Advanced Nano Stencil technology, the company launched an exciting re-branding featuring a new website and company presentation during the event.
Industry News | 2023-02-06 14:08:21.0
KYZEN announced its '2022 Representatives of the Year' during the recent IPC APEX EXPO at the San Diego Convention Center in California. Southwest Systems was presented with KYZEN's 'Rising Star Award' and SMarTsol received the 'Sales Partner of the Year Award'.
Industry News | 2023-10-30 19:18:06.0
Martin Hart announces that his recent ground-breaking paper and presentation, titled "Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers", is available on the TopLine web site and is available for free download. It was presented by Hart at IMAPS 2023 in San Diego, California recently.
Industry News | 2023-01-04 18:57:04.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.
Industry News | 2022-01-05 09:15:19.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California. After a lengthy lock-down, Koh Young will embrace the comprehensive safety and hygiene protocols in place to ensure a safe environment for attendees, so that the industry can meet face-to-face. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1717) and the Factory of the Future Pavilion (1701). The following is just a glimpse into what Koh Young will have in store for our visitors.
Industry News | 2018-01-16 17:25:38.0
The speed of change in the electronics industry is rapidly accelerating. The direction in which the industry moves is constantly shifting...and it needs participation, see you in San Diego! JTAG Technologies is excited to showcase here in San Diego the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB) layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
