Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/spray-fluxing
: The Atomizing Spray Flux Applicator is not recommended for no-clean processing. The Nordson SELECT FluxJet Precision Drop-Jet Flux Dispenser should be used when printed circuit boards will not be cleaned after selective soldering
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. The cleaning room contains two layers of cleaning baskets, which can clean more boards at one time. Thoroughly and effectively clean organic and inorganic pollutants such as rosin, no-clean flux, water-soluble flux and other organic and inorganic pollutants on the surface of SMT/THT PCBA after soldering
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