![[SEC] SEM(Scanning Electron Microscope) SNE 4500M Plus Premium Version of Highest-end](https://img.youtube.com/vi/C9ny0wTR8mY/sddefault.jpg)
#SEM#SEC#??????? Model: SNE-4500M Plus (A) / (B) Resolution: 5nm (30kV, SE Image) Magnification: 30x~150,000x Detector: Secondary Electron(SE) / Backscattered Electron(BSE) Vacuum: High / Low Stage: X,Y, Z, R, T : Fully motorized Navigation mode wi
New Equipment | Test Equipment
The REVETEST® Scratch Testing instrument has become the industry standard for measuring hard-coated materials, with a typical coating thickness of several microns. Coatings may be organic or inorganic, covering Tribological, magnetic and decorative
Industry Directory | Manufacturer
Pemtron develops and manufactures 3-D Solder Paste Inspection, 3-D Nano Profilers and Scanning Electron Microscopes
Industry Directory | Manufacturer
The inspection specialists with over 15 years experience in the AOI market. Manufacturers of Scanner Based AOI and Image Comparators. Distributors of high specification Video Microscopes, X-Ray & Camera Based AOI.
New Equipment | Test Equipment
The CSM Instruments Micro-Hardness Tester provides over three decades of normal force range and thus is ideally suited to the mechanical characterization of hard coatings, thick soft coatings and bulk materials. It provides accurate and reproducible
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
New Equipment | Test Equipment
THE NEW GENERATION OF NANOINDENTER CSM Instruments has introduced a new nano range high resolution nanoindenter with ultra low thermal drift. When used per ISO 14577 test methods the Ultra Nano Hardness Tester will provide the most accurate data of
SNE-4500M Plus The Highest-end Tabletop SEM Cost-effective Table-top SEM with Max. 150,000x of magnification by miniaturizing modules. Able to scan images with high resolution of 5nm by the installation of the variable aperture with ease of us
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
