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FINE LINE STENCIL Wins a 2008 VISION Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-04-08 22:33:32.0

COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.

FCT ASSEMBLY, INC.

FINE LINE STENCIL Wins a 2008 Advanced Packaging Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-07-19 14:36:57.0

COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

FCT ASSEMBLY, INC.

Electronic SMT X ray Original tape and reel X1000 SMT/SMD components

Electronic SMT X ray Original tape and reel X1000 SMT/SMD components

Videos

Contact Joy Rong for details and price list   WhatsApp/wechat/Skype?+86 18779975930 Email: joyrongzhuomao@outlook.com Email: info@seamarkxray.com Web: www.seamarkxray.com Features:  Automatic component recognition - Automated parameter setting and co

Seamark zm Tech Group

Marquardt Relies on Viscom S3088 SPI and Quality Uplink – 3D Solder Paste Inspection and Process Optimization

Industry News | 2013-11-05 10:04:10.0

Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.

Viscom AG

The refinement of PCBA electronic components boosts the development of X-ray testing technologies

Industry News | 2022-08-23 03:26:21.0

Today's smart wearable and automotive electronic products are increasingly developing towards small, light, thin, short, and multi-functional Friendly mobile phone assembly and manufacturing new materials, what challenges will PCBA circuit board assembly technology and circuit board testing and testing technology face, and which aspects will it develop towards, ICT testing, flying probe tester, AOI testing, X-Ray inspection, 3D-CT inspection, etc., has become one of the important hot topics discussed in the electronics manufacturing industry.

Unicomp Technology Co., Ltd

Data I/O FlashCORE III Programming Technology to Debut at Productronica

Industry News | 2009-12-07 18:08:56.0

Data I/O Corporation (NASDAQ: DAIO), the provider of manual and automated device programming solutions, today announced plans to debut its new FlashCORE III programming architecture at Productronica in Hall A2, Stand 329. This new technology will be at the core of every product to be highlighted at this key industry event, scheduled to take place 10th – 13th November at the Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation

smt scrap reduction

Electronics Forum | Mon Jun 06 10:14:05 EDT 2005 | stepheniii

The biggest most important overall factor I have seen is the personel running and looking after the equipment. Any plan not involving them will probably not be effective. The front line people can probably tell you more than you can tell them. I hav

Acceptable standards

Electronics Forum | Tue May 31 18:08:45 EDT 2005 | K

All good points and thank you for your replies. Most of the components lost are discretes. The problem I have is my operators gather any SOIC "lost components" and return them to stores in a small metallised bag. This in turn goes into a 16" X 12" X

Manufacturing in China, Revisited

Electronics Forum | Tue Oct 19 22:51:07 EDT 2004 | KEN

I feel it is less pressure from consumers and more from stock holder increased demands for dividends. Every quaters end our publicly traded customers go bezerk on increased orders to show increased finished goods and less component inventory. All t


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