Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Wed Jan 05 16:46:44 EST 2000 | Dennis O'Donnell
Several methods work well. 1. (Low Volume Method) Using an Xacto blade, scrape off the solder mask holding the blade flush being careful not to use the pointed part of the blade. 2. (High Volume Method)Tape off the area that you don't want the mas
Electronics Forum | Tue Jun 25 11:26:11 EDT 2002 | pdt203
Sometimes when a customer has sent parts on reel without any leader, we will take out the first 5-8 parts and then tie off the cover tape with some leftover tape from the last run. We keep those parts we removed and then place them back in the feede
Electronics Forum | Tue Jul 02 14:24:30 EDT 2002 | paul_bmc
My question is refering to "stencil life". How accurate is this and is this something I can go by. The solder paste I am using is Kester R562, R562 specifications state that it has a 12 hour stencil life, optimal temp ranges 70-77 F, 35-65% RH. Ou
Electronics Forum | Sat Apr 12 09:47:07 EDT 2003 | davef
... continuing with Q2: How do you remove and replace? A2: Belt sander, sand blasting, grinding wheel, etc. Parylene/Paraxylyene is a great coating and can be selectively removed by several methods. The IPC-7711 (Rework of Electronic Assemblies)
Electronics Forum | Tue Mar 08 09:56:05 EST 2005 | caldon
Tim- You have two separate issues 1) Stencils and 2) wave. Stencils you can purchase a ultrasonic system that will remove the paste automatically or you can use stencil wipes to remove it manually. I would refrain from using towels and IPA as it dilu
Electronics Forum | Wed Mar 09 08:23:31 EST 2005 | davef
We don't have experience on this, but first we'd talk to a technical type at our solder paste supplier. Baring that, we'd: * Soak a paper towel in a 'solvent' [ie Kyzen XJN, EnviroSense Enviro Gold, Petroferm Hydrex, etc]. * Place the towel in conta
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Fri Jun 03 16:35:40 EDT 2005 | davef
We've never tried to remove Paraylene from a BGA, but we stayed [in seperate rooms] at the Red Roof Inn. Parylene/Paraxylyene is a great coating and can be selectively removed by several methods. IPC-7711 (Rework of Electronic Assemblies) has a sect
