Industry News | 2010-08-02 12:55:28.0
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that its plastic adhesive tools are ideal for smoothing sealants and adhesives for many aerospace applications. With sealant scrapers manufactured from Celcon®, and spatulas from glass-filled Nylon, these unique tools guarantee not to damage delicate substrates found in the aerospace industry.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Industry News | 2008-10-07 18:09:52.0
MILPITAS, Calif. � October 2008 � Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, announces that its Chassis Cart is now offered with optional 19" rackmount bracket, ideal for burn in and test.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2009-12-10 01:02:42.0
EAST WINDSOR, CT — December 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, introduces THE AQUAVATOR™ stencil wiping fabric, a revolutionary new development within the science of automatic stencil cleaning.
