Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Tue Dec 12 07:01:45 EST 2000 | Chris Betlejewski
Does anybody know how often you should scrape the dross off the solder pot? What happens if too much dross is left? How often should the solder pot be cleaned?
Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul
I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.
Electronics Forum | Tue Jun 25 10:36:10 EDT 2002 | Vincent Balboni
Do you have a fixed number of components that you write off each time a feeder is loaded.
Electronics Forum | Tue Dec 17 17:22:45 EST 2002 | Tim Marc
Thanks Russ. You were right I looked one page too far. We can meet (A,B,C,D). To meet the 75% of (E) the annular ring will have to be scraped. Your help was much appreciated.
Electronics Forum | Thu Mar 13 14:51:23 EST 2003 | juan_ruiz
A good standard could be 99.7% of Pick up reliability in terms of machine performance, but you should take care of the cost of the parts that you are scraping.
Electronics Forum | Fri May 14 14:13:54 EDT 2004 | bwet
Does anyone know of a technique t selectively remove solder mask outside of the traditional scraping or grinding methods. (This would be in areas around an area array part.) BWET
Electronics Forum | Fri May 14 15:27:19 EDT 2004 | davef
Other methods [than scraping or grinding] for removing soldermask from a board are: * Chemicals * Microblasting
