Electronics Forum | Wed Jun 19 12:06:20 EDT 2013 | rgduval
We only reapplied in areas where significant wear was observed. As I mentioned, shop chairs moving back and forth, combined with lead trimmings and other debris led to scraping and peeling over time. Other than that, no, we did not re-apply over
Electronics Forum | Mon Jul 29 11:15:05 EDT 2013 | kjs123p
We used to scrape off the paste with a plastic putty knife and then place the boards in our Smart Sonic stencil cleaner that we used to clean the stencils in. It worked well.
Electronics Forum | Thu Sep 24 08:05:59 EDT 2020 | majdi4
In my opinion, it is not possible to eliminate the oxidation in a component because oxidation it is not removable .. the only solution is to apply a mechanical operation (scraping) and then tinning the part..
Electronics Forum | Mon Feb 08 12:06:25 EST 2021 | bobpan
Make sure the pins on the chip on the main display are not bent or tarnished...i have scraped the bottom of the legs before. I would try Reprint in UK. I think they still have parts.
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Thu Oct 05 17:05:36 EDT 2000 | JAX
These types of foil kits work just fine as long as they are used before expiration. Scraping off the epoxy coat gets a little tough on fine pitch pads and etches. I have always like to use a solder sample board to retrieve my bits & pieces from whene
Electronics Forum | Fri May 19 14:33:30 EDT 2000 | Lawrence A. Groves
I did this at one point and found that the handleing is critical. What usually happened is that two of the PCBs would touch and the edge of one would scrape the parts off the other. I tried a couple of different epoxys and ended up with a CIBA prod
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Mon Apr 26 17:12:14 EDT 2004 | babe
Take a solder iron with some wire solder and attempt to tin the leads of the component. Look under magnifier or microscope. Did they wet? If not try fluxing them with liquid flux and then soldering again. Did they wet? If they did not then you may wa
Electronics Forum | Fri Apr 30 11:18:23 EDT 2004 | Bryan She
These days I've met much CSP fails.it's .5mm pitch,5x5mm outline CSP.we must reball it and mount it again on the boards because these Parts are very expensive and we can't scrape it off.is there anyone has any precieus experience or suggestions?or wh
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