Full Site - : screen and printing and in and vias (Page 1 of 6)

MIRTEC to Demonstrate the Latest in Their Award-Winning 3D AOI and SPI Systems at SMTAI

Industry News | 2019-08-21 16:55:59.0

MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.

MIRTEC Corp

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

MIRTEC to Present Complete Line of Advanced 3D AOI and SPI Inspection Systems in Exclusive ONLINE CONFERENCE & EXPO

Industry News | 2020-06-30 15:07:32.0

MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.

MIRTEC Corp

screen printing machine,PCB screen printer , auto pcb screen printer , LED screen stencil printer, PCB solder paste printer

screen printing machine,PCB screen printer , auto pcb screen printer , LED screen stencil printer, PCB solder paste printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

IPC APEX India Educational Workshops to Address Design, Assembly and Process Challenges in Electronics Manufacturing

Industry News | 2013-07-24 16:39:34.0

IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.

Association Connecting Electronics Industries (IPC)

IPC APEX India Educational Workshops to Address Design, Assembly and Process Challenges in Electronics Manufacturing

Industry News | 2013-07-24 22:01:53.0

IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.

Association Connecting Electronics Industries (IPC)

Advances in Conductive Inks across Multiple Applications and Deposition Platforms

Technical Library | 2012-12-27 14:35:29.0

Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.

DuPont

Metcal, Nikon and Nordson ASYMTEK to Co-Host BGA Rework and Repair and X-Ray Inspection Seminar at ACI Technologies in Philadelphia

Industry News | 2013-05-01 20:51:31.0

Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.

OK International

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Technical Library | 2016-11-30 15:53:15.0

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.

Raytheon

Speedline Announces New Representation in Wisconsin and Illinois

Industry News | 2013-02-13 20:43:58.0

Speedline Technologies announces the expansion of sales representation in the Wisconsin and northern Illinois territories by Electri-Rep. Electri-Rep also represents the entire Speedline product line in Kansas, Missouri, Nebraska, Iowa, and Southern Illinois with sales personnel located in Kansas City and St. Louis.

Speedline Technologies, Inc.

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