Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2019-10-24 10:36:03.0
The third annual M-EXPO Wire Processing Technology event held in Ciudad Juárez, México at the Cuatro Siglos Convention Center on October 9-11, 2019, exceeded expectations. This event was co-located with the ninth annual EXPO-MRO. These two events hosted more than 6,500 attendees.
Industry News | 2018-10-18 11:18:14.0
Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design
Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2020-03-19 00:23:15.0
In this study, the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids, such as solder paste and conductive adhesives. The goal of this study was to develop a general method for hypothesis testing when robustness tests are performed. The main problem was to determine if there was a statistical difference between two means or proportions of jet printing devices. In this study, an example of jetting quality variation was used when comparing two jet printing ejector types that differ slightly in design. We wanted to understand if the difference in ejector design can impact jetting quality by performing robustness tests. and thus answer the question, "Can jetting differences be seen between ejector design 1 and design 2"?
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
