Full Site - : selective solder sac305 profile (Page 15 of 84)

Contamination Profile of Printed Circuit Board Assemblies in Relation to Soldering Types and Conformal Coating

Technical Library | 2017-12-11 22:31:06.0

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.

Technical University of Denmark

ASSCON VP1000 Vapor-Phase Soldering Machine

ASSCON VP1000 Vapor-Phase Soldering Machine

Videos

The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with lead-free solder pastes. The machines are particular suited for users who process product with fr

A-Tek Systems Group LLC

Solderstar PRO - The Ultimate Profiling Solution

Solderstar PRO - The Ultimate Profiling Solution

Videos

The Solderstar Pro - The only profiling datalogger you will ever need.

Solderstar

Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at APEX 2008

Industry News | 2008-03-15 15:22:12.0

OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.

Indium Corporation Technology Experts Presenting at APEX

Industry News | 2010-04-09 21:17:21.0

Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.

Indium Corporation

Z Elektronika Kft.

Industry Directory | Manufacturer

The Z Elektronika dynamically growing electronics developer and manufacturing company. Since 1997, dealing with electronic products manufacturing, from SMT through hand assembly to wave soldering.

Optimizing Stencil Design For Lead-Free Smt Processing

Technical Library | 2023-06-12 19:18:24.0

As any new technology emerges, increasing levels of refinement are required to facilitate the mainstream implementation and continual improvement processes. In the case of lead-free processing, the initial hurdles of alloy and chemistry selection are cleared on the first level, providing a base process. The understanding gained from early work on the base process leads to the next level of refinement in optimizing the primary factors that influence yield. These factors may include thermal profiles, PWB surface finishes, component metallization, solder mask selection or stencil design.

Cookson Electronics Assembly Materials

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

ACE KISS - 104

ACE KISS - 104

Used SMT Equipment | Soldering - Selective

ACE KISS 104 Selective Solder Model: KISS 104 Vintage: 2007 Voltage: 115/120 Two (2) pots - One leaded, one lead-free FEATURES: The KISS-104 is a fully configured In-Line SMEMA compatible Selective Soldering Machine ready to produce your produ

Recon Inc


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