Industry News | 2017-09-15 11:41:47.0
Solderstar, a leading provider of thermal profiling equipment for the Electronic Manufacturing sector, will showcase its innovative range of intelligent dataloggers and measurement products at the forthcoming SMTA 2017 exhibition, held in Rosemont, IL. A full range of equipment will be available at the booth for demonstration, including the Solderstar PRO range of profiling tools which help streamline the whole profiling operation for reflow ovens, wave/selective soldering machines and the vapor phase process. The latest version of Profile Central – Solderstar’s reflow profiling analysis software will also be available for demonstration providing many new features.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Industry News | 2017-03-17 15:27:38.0
KIC today announced plans to introduce its new thermal profiler. This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, our new smart profiler also suggests an improved reflow oven setup.
New Equipment | Rework & Repair Equipment
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas
Industry News | 2018-05-18 11:06:33.0
Clearwater, FL - Solderstar, a leading provider of thermal profiling equipment for the Electronic Manufacturing sector, will showcase its innovative range of dataloggers and smart thermal profiling products at the forthcoming Michigan Expo & Tech Forum.
PC-Controlled Rework. Easy to use, compact rework station is the perfect system for those who are ready to move up from manual, hand rework. With controllable profiles, it uses precision hot air from the top and a fast acting IR underheater. Handle
Industry News | 2015-03-07 18:35:19.0
SolderStar Ltd, a world leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, will be highlighting a number of innovative products, including its latest advancement in selective soldering, at SMT Hybrid Packaging in Nuremberg, Germany from 5 – 7th May 2015.
Industry News | 2014-09-15 11:17:12.0
SolderStar Ltd, one of the world’s leaders in thermal management systems, with an extensive portfolio including profiler equipment and software tools, will present its range of products for the first time at Productronica India from 23 – 25 September.
Industry News | 2014-09-15 11:53:31.0
SolderStar Ltd, one of the world’s leaders in thermal management systems, with an extensive portfolio including profiler equipment and software tools, will present its range of products for the first time at Productronica India from 23 – 25 September.
New Equipment | Rework & Repair Equipment
The PCT-1000 is a programmable preheater that provides users the ability to increase heat capacity with highly controlled thermal output. The PCT-1000 can be used in a variety of processes including soldering, desoldering, SMD rework operations and,
