ALPHA® Preforms with solder paste adds solder volume.
Industry News | 2008-03-09 00:07:32.0
OSAKA, JAPAN � March 6, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper with DfR Solutions, titled �Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,� to the Technical Conference that is part of the IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics scheduled to take place March 11, 2008 at the Sheraton Raleigh Hotel in Raleigh, North Carolina.
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Industry News | 2018-08-06 05:59:56.0
Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover. The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products.Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.
Industry News | 2014-08-07 11:41:44.0
Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Industry News | 2009-04-13 16:28:45.0
ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2021-02-12 16:08:40.0
Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2022-11-15 12:50:53.0
Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
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