Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt
HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N
Electronics Forum | Thu Dec 21 15:13:16 EST 2017 | georgetruitt
Is the process the same for every product running through the selective solder machine? Load program, acquire or set up fixture, Change/load flux?, Change/Load solder pot? Are the machines cold when the operators need to use them or are the machin
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Thu Apr 25 18:32:25 EDT 2002 | Shawn
What he is talking about when he said "foil" is the top and bottom side of the board has a layer that is like a ground plane with no solder resist covering it. It is etched out around the pads that no not need a connection and have a small bride or t
Electronics Forum | Thu Nov 08 09:51:09 EST 2007 | rgduval
Where are the shorts occurring on the 96 pin connector? Are they consistently in the same areas? It looks as though there are a number of pins connected by traces on the board, and/or the ground plane. This would cause a lot of repeatable shorts i
Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng
Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea
Electronics Forum | Wed Feb 13 19:32:02 EST 2008 | daxman
Greetings everyone. We are currently doing some experimentation with solder paste printing over ground planes. In this application, the entire perimeter of the PCB is a ground plane. It's about 4mm wide and wraps around the whole PCB; There is no so
Electronics Forum | Thu Aug 07 19:48:23 EDT 2003 | Shawn
We do allot of multi layer boards with heavy ground planes or heat sinks attached. We have a Trieber, use RMA flux, solder pot temp at 500F, foam fluxer, spray the top if need be, and would warm up the PWB to around 240F over the preheaters. We have
