Electronics Forum | Mon Dec 27 19:10:58 EST 2021 | ppcbs
The component should float into place provided you have the correct amount of solder paste. Perform a solderability test on the pads. We have come across new components with oxidation that prevents wetting. This will cause components to not self ali
Electronics Forum | Mon Apr 23 11:31:23 EDT 2001 | Cal
You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample b
Electronics Forum | Thu Jun 29 08:41:24 EDT 2006 | russ
I agree that a BGA may be the better/easier process overall, but it is not 3 dollars per assy better, I am in agreement that you should be able to handle QFPS just as well as a BGA. PBfree BGAs do not self align BTW, so one needs to keep that in mi
Electronics Forum | Fri May 15 00:07:38 EDT 2015 | aapsmt
there can be so many different causes. can be component library height issues. step program z axis offsets - i have seen accidental positive values entered so the components are literally dropped onto the pcb haha. but it does depend on the size of
Electronics Forum | Wed Aug 22 10:57:59 EDT 2001 | wbu
Hi Steven, BGA�s are known for their ability to self align and from own experiance they do. There�s enough documentation on this one available (...don�t have the links present like Dave but I�m sure he will give you enough to spend some evenings rea
Electronics Forum | Sat Jun 04 12:11:49 EDT 2011 | davef
Q1) How to identify on good or bad RF shield that could contribute to dewetting? A1) We use Alloy 770 and 752 [German silver] for our RF shields. We have never seen a solderability issue, even aged stock solders well. * Nickel Alloy 752, Nickel Silv
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Mon Jan 23 21:56:50 EST 2017 | jgo
Hi all, Am new to the SMT process. I'm in the process of purchasing a new SMT Pick & Place machine and am trying to figure out how to perform the buy-off. I'm from the semiconductor packaging background. For any new machine purchase, I'm used to se
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