Industry Directory | Distributor
Formed in 1990, we supply SMT Splicing Tapes & SMT Adhesives. We are the exclusive European & USA distributor for Fuji Chemical Industrial Co Ltd, Japan.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Parts & Supplies | THT Equipment
Below are Universal spare parts (NEW & ORIGINAL) for sale , feel free to contact us if you are interested . 10077003 WOODRUFE KEY 404 10131018 BEARING FLANGED 10219002 BUSHING 16DU 16 10219010 BUSHING 10DU 14 10249072 COM SPRING 10249194 COM
Industry News | 2011-03-23 15:36:29.0
Multitest announces that its MT2168 pick-and-place handler offers significant yield advantages based on its unique and industry-leading positioning concept.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Used SMT Equipment | Screen Printers
MPM Speedline ACCUFLEX Screen Printer - Refurbished Model: Accuflex Vintage: 05/2005 2D post inspection Rotary Pin Placement Option Pressure Feedback Control Squeegee Head Underwipe Stencil Cleaner Fiducial Recognition fo
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Used SMT Equipment | Screen Printers
MPM Speedline ACCUFLEX Screen Printer - Refurbished Model: Accuflex Vintage: 04/2005 2D post inspection Rotary Pin Placement Option Pressure Feedback Control Squeegee Head Underwipe Stencil Cleaner Fiducial Recognition for Stencil to PCA Align
Industry News | 2018-08-14 17:57:21.0
Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
