Used SMT Equipment | Screen Printers
right, right--> left, left-> left, right--> right, pass through Conveyor configuration front or rear fix PCB transport width adjustment motorised, software controlled PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness S
Industry News | 2015-04-21 16:57:06.0
The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Used SMT Equipment | Pick and Place/Feeders
JUKI KE760L / Zevatech FM760 : Completely working machine in good conditions, with some spare parts, nozzles renewed, spare mainboard/computer with LCD, manuals, etc. Supplied with 2troleys with about 70 various feeders, rack for spare feeders availa
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
Industry News | 2008-04-29 22:50:47.0
MORRISVILLE, NC - April 23, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, walked away from the APEX show in Las Vegas and the NEPCON/EMT Show in Shanghai winners of no less than five prestigious industry awards.
