Offering HCT-600SV full automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 40,000CPH * 8 placement heads * Maximum PCB size 600×380mm * Placement accuracy: ±0.05mm * Component range: 0603~5050~7474, hi
High quality PCB depaneling machine / V-cut PCB depanelizer,multi-blade depaneling machine,Pcb Separator Feature 1. The shaft of the knives( top and bottom) is design to be an an integral whole, it is convenient to install, pick and place. 2.T
PCB router is used to cut PCB with holes,single or double desk working mode. www.jwide-smt.com sales@jwide-smt.com
The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in
The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in
Improve manufacturing operations and decision making based on real time shop-floor information Achieve goals for on-time delivery, eliminated waste, asset utilization, first pass yield, DPMO and total traceability. Valor IoT manufacturing collects
SelFlux-400 is a single rail in-line selective spray fluxing machine with an individual controlling system. It is equipped with a X/Y servo table and spraying nozzle, flux is supplied by the use of a constant pressure tank, the nozzle’s travel path c
EAO, the Expert for Human Machine Interfaces, is now offering a switch with multicoloured “Halo” illumination for creating highly flexible displays. Designed for use with SMD LEDs, up to 10 different colours can be combined in one switch: eight withi
Cost effective automated stencil printer compatible with standard frames covering a 16" X 18" (406mm x 457mm) print area with power sweep squeegee. Automate Stencil Printing using the SPR-45 with power sweep squeegee and power frame lift for higher
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830