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FCT Solder to Highlight SLIC� Paste at SMTA International 2008

Industry News | 2008-08-04 13:01:17.0

GREELEY, CO � August 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will display SLIC� Paste in booth 125 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.

FCT ASSEMBLY, INC.

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.

Indium Corporation to Exhibit at Regional SMTA Shows

Industry News | 2004-09-28 13:23:18.0

Indium Corporation of America will be exhibiting at several regional SMTA Trade Shows during the month of October

Indium Corporation

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.

SHENMAO wins Global Technology Award for SM-862 Liquid Flux

Industry News | 2018-10-17 20:13:20.0

SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.

Shenmao Technology Inc.

SHENMAO receives Mexico Technology Award for new liquid flux

Industry News | 2018-11-16 16:38:33.0

SHENMAO America is pleased to announce that it was awarded a 2018 Mexico Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

SHENMAO Picks up Third Award for New Liquid Flux

Industry News | 2019-01-30 08:42:31.0

SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Shenmao Technology Inc.

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

Industry News | 2024-05-13 10:19:11.0

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.

Shenmao Technology Inc.

SHENMAO America Partners with Southwest Systems Technology, Inc.

Industry News | 2018-12-11 19:17:48.0

SHENMAO America, Inc. is pleased to announce the appointment of Southwest Systems Technology, Inc. as its representative in the states of Texas, Oklahoma, Arkansas and Louisiana. The company has offices in Texas and Mexico.

Shenmao Technology Inc.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components

Industry News | 2022-04-13 10:04:24.0

SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.

Shenmao Technology Inc.


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