Full Site - : shear test (Page 3 of 18)

Material Lab Technician

Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin

Winslow Automation (aka Six Sigma)

Fully automated bond tester

Fully automated bond tester

Videos

The Condor Sigma is the only truly fully automated bondtester in the world. In the video you see an operator clamping her sample on the Condor Sigma. She presses 'start', the tester references by fiducial mark, does a series of pull and shear tests a

XYZTEC bv

More BGA Defect Examples Available Royalty FREE

Industry News | 2017-01-05 04:27:37.0

BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:

ASKbobwillis.com

Brock Electronics Ltd.

Industry Directory | Manufacturer's Representative

SMT assembly equipment including placement, reflow & vapor phase soldering, cleaning, X-Ray, AOI, SPI, conveyors. First Article Inspection (FAI). Consumables, splicing systems & tools, splice tape & clips. Understencil wiping Roll

Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China

Industry News | 2014-07-30 12:10:12.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Nordson DAGE

Nordson DAGE and Nordson YESTECH to Display X-ray and AOI Systems at NEPCON China

Industry News | 2014-04-16 13:17:25.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.

Nordson DAGE

Latest Condor Sigma software release enables automatic grading

Industry News | 2016-12-02 11:33:11.0

One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.

XYZTEC bv

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation

Nordson DAGE to Exhibit Best-in-Class Test and Inspection Equipment at NEPCON China

Industry News | 2015-04-02 18:36:37.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand B-1F28 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Nordson DAGE’s team of Test and Inspection experts will demonstrate the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system.

Nordson DAGE

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Technical Library | 2020-07-02 13:29:37.0

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.

Alpha Assembly Solutions


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