Electronics Forum | Thu Mar 31 19:41:36 EST 2005 | Dreamsniper
Can anyone guide me to what test do I need to be able to identify the strength of my fine pitch component solder joint? What value is available that I can use as a reference? Say 1.5 kg, 2.0 kg, 2.5 kg etc. I would like to have my fine pitch compone
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Fri May 14 11:24:00 EDT 1999 | Chrys Shea
| Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayland Mas
