Full Site - : sheet metal for solder nozzle (Page 5 of 8)

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Preview for AdoptSMT - SMT Nuremberg 2016, April 26-28, Stand 7-100

Industry News | 2016-03-07 14:06:37.0

Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.

AdoptSMT Europe GmbH

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Industry News | 2018-10-18 11:18:14.0

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Flason Electronic Co.,limited

AAT's Mega™ II Cleaner Ideal for Flip Chip, Advanced Package Cleaning

Industry News | 2001-06-26 09:50:17.0

The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.

Austin American Technology

ESSEMTEC to Demonstrate Solutions for the Entire Production Process at the 2012 IPC APEX Expo

Industry News | 2012-01-21 00:40:52.0

Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.

ESSEMTEC AG

ESSEMTEC to Exhibit Its Scorpion in America for the First Time at the IPC APEX EXPO

Industry News | 2013-01-14 14:43:06.0

Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO

ESSEMTEC AG

Meet Seika Machinery at the 2012 IPC APEX Expo for a Glimpse into Its World Renowned Storage Cases and Equipment

Industry News | 2012-01-21 17:15:20.0

Seika Machinery will showcase its proven, advanced machinery in Booth #2401 at the upcoming IPC APEX Expo.

Seika Machinery, Inc.

Kester Launches SELECT-10™ Selective Solder Flux

Industry News | 2016-04-22 10:20:35.0

Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.

Kester


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