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Bentonite Desiccants and Silica Gel Desiccants

Bentonite Desiccants and Silica Gel Desiccants

Videos

The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main

Clariant Cargo & Device Protection

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Clariant Whitepaper on Performance and Sustainability of Bentonite Clay Desiccants in Moisture Controlled Packaging

Industry News | 2017-10-05 12:40:41.0

The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.

Clariant Cargo & Device Protection

Parts and Assembly Storage Life: How to Determine and Manage

Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,

Parts and Assembly Storage Life: How to Determine and Manage

CALCE Center for Advanced Life Cycle Engineering

BGA Package Component Reliability After Long-Term Storage

Technical Library | 2009-12-03 14:27:29.0

This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages.

Texas Instruments

Solder Preforms

Solder Preforms

New Equipment | Solder Materials

70% have a shelf life of 6-months from the DOM.

Indium Corporation

Keeping Tin Solderable

Technical Library | 1999-05-06 15:31:13.0

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...

TE Connectivity

Component Reliability After Long Term Storage

Technical Library | 2009-12-03 12:51:58.0

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension.

Texas Instruments

SMD Adhesives - Epibond�

New Equipment |  

Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st

Cookson Electronics

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