Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2017-10-05 12:40:41.0
The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
Technical Library | 2009-12-03 14:27:29.0
This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages.
Technical Library | 1999-05-06 15:31:13.0
Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...
Technical Library | 2009-12-03 12:51:58.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension.
Specialists in end-of-life preservation packaging of electronics. Shelf-life consultants. Marketing, sales and distribution of Static Intercept and Corrosion Intercept Reative Polymers. Eliminating rust, tarnish and corrosion in metals-chemical free
Technical Library | 2021-01-28 01:55:00.0
Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application.
