Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2015-12-17 17:24:17.0
Product quality can be improved through proper application of design for test (DFT) strategies. With today's shrinking product sizes and increasing functionality, it is difficult to get good test coverage of loaded printed circuit boards due to the loss of test access. Advances in test techniques, such as boundary scan, help to recover this loss of test coverage. However, many of these test techniques need to be designed into the product to be effective.This paper will discuss how to maximize the benefits of boundary scan test, including specific examples of how designers should select the right component, connect multiple boundary scan components in chains, add test access to the boundary scan TAP ports, etc. A discussion of DFT guidelines for PCB layout designers is also included. Finally, this paper will include a description of some advanced test methods used in in-circuit tests, such as vectorless test and special probing methods, which are implemented to improve test coverage on printed circuit boards with limited test access.
The ECONO fabric adjustable wrist strap features a �one of a kind,� patented design. The unique crochet process incorporates continuous strands of highly conductive silver-coated nylon monofilament placed on the underside of the non-conductive nylon
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Hot Air Welding Gun PL160 The hot air welding gun suitable for surface mount soldering and rework parts, such as: SOIC, CHIP, QFP, PLCC, BGA, etc. it’s also used in welding hot melt plastic materials such as PE, PP, EVA, PVC, PVDF, TPO and other
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PARMI HS70 3D Solder Paste Inspection Machine (2011) Brand: Parmi Model: HS70 Solder Paste Inspection Machine Serial #: H7S0 Year: 2011 Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2 Conveyor Inspection Program: Single Lane
“The Ultimate Probing Machine”. Ultra Fast full Function Patented Double-sided, Closed Loop 22-probe System, All probes are Analog, Digital, Boundary Scan, and Vectorless Test enabled. Use it In-Line or manual operation with AOI capabilities. The
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3HAC022031-005 3HAC022031-005 ZhongHaiDe (Fujian) Industrial Equipment Co., Ltd. ,located in Fuzhou,Fujian province, is a leading equipment supplier in the field of automation in China since its estab
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The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
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Cable assembly What is the cable assembly? A cable is two or more wires that are wrapped together within a single cover.A cable assembly is a specific type of cable harness assembly used to house wires and cables. The exterior covering is made of t
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Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
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