Industry Directory | Equipment Dealer / Broker / Auctions
We specialize in USED test equipments, such as spectrum analyzer, network analyzer, signal generator, WLAN tester, power meters, signal analyzer, power supply, RF/wireless communication test set, Blue
Industry Directory | Consultant / Service Provider
we are always looking for E5515B/C option:002; 003; or both 002,003 GB:40 or higher. and we also need DC power supplies.
New Equipment | Test Equipment
The Rohde & Schwarz (R&S) FSIQ7 is a high performance Vector Signal Analyzer with a frequency range of 20 Hz to 7 GHz that was designed for the 3G radio generation. Features and Specifications of the R&S FSIQ7 Analyzer include: • FSIQ 7: 20 Hz t
New Equipment | Test Equipment
SIGNAL ANALYZER Frequency: 20Hz Output: -60dBm Modulation: AM,FM,PH FSIQ Signal Analyzer for the 3rd Mobile Radio Generation Features: Spectrum Analysis with Ultra-wide Dynamic Range for Sophisticated ACPR Measurements NF = 15 dB/TOI = +20 dBm
Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL
With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including
Electronics Forum | Fri Apr 21 13:26:15 EDT 2000 | Bob
I'm working on a project that requires that I analyze a signal from the parallel port of my computer and use it to turn on relays. There are about 19 relays to control, and I designed all the gates to get each one on, but there is a problem with keep
Used SMT Equipment | General Purpose Test & Measurement
Communications Signal Analyzer Tektronix CSA 8000 Communications Signal Analyzer. Good condition SN# B010490 4-B SN# B010490. Asset# 0970. Hit # 2045296. Asset Located in Kanata, Ontario, Canada.
Used SMT Equipment | In-Circuit Testers
Agilent 8757D The Agilent 8757D scalar network analyzer allows you to measure insertion loss, gain, return loss, SWR, and power quickly and accurately . With high-performance detectors and directional bridges, and a companion Agilent source and p
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-06-20 08:54:22.0
Service Pack 1 for P-CAD 2002 released today
Technical Library | 2021-05-06 13:45:49.0
The high-sensitive micro eddy-current testing (ECT) probe composed of planar meander coil as an exciter and spin-valve giant magneto-resistance (SV-GMR) sensor as a magnetic sensor for bare printed circuit board (PCB) inspection is proposed in this paper. The high-sensitive micro ECT probe detects the magnetic field distribution on the bare PCB and the image processing technique analyzes output signal achieved from the ECT probe to exhibit and to identify the defects occurred on the PCB conductor. The inspection results of the bare PCB model show that the proposed ECT probe with the image processing technique can be applied to bare PCB inspection. Furthermore, the signal variations are investigated to prove the possibility of applying the proposed ECT probe to inspect the high-density PCB that PCB conductor width and gap are less than 100 μm.
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
2015 Europlacer iiNeo Auction December 1, 2016 www.xlineassets.com
Rohde & Schwarz CMU200 Loaded with Options THIS UNIT INCLUDES OPTIONS: B12,B21,B54,B56,B68,B96,U99.U65,K16,K17,K20,K21,K22,K23,K24,K29,K42,K43,K47,K48,K53,K57,K58,K59,K61,K62,K63,K64,K65,K66,K67,K68 Rohde & Schwarz CMU200 Universal Radio Commun
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | New Orleans, Louisiana USA | Engineering,Technical Support
Electronic Technicians (2) If you have been searching for a beautiful place to relocate that also offers lots of activities on the weekend, this position may be your target. This client is located in New Orleans overlooking a beautiful lake that ma
Career Center | Racine, Wisconsin USA | Engineering
We have an urgent requirement for one of our Direct client. Please go through the job description below and revert with updated resume if it would be of your interest. Major job duty/accountability 40% of Construction of Models, and Prototypes
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | , | Maintenance,Management,Quality Control,Technical Support
Software: Over 14 years experience in operating and maintaining of different types of Telecommunication and IT equipments � Proven proficiency in operating and maintaining of TDM telecommunication equipment - digital exchanges AXE10 (Ericsson) � Pr
Baja Bid | https://bajabid.com/baja-bid-online-auction-june-3-5-2014-featuring-items-onechip-photonics-press-release-2/
• Dage 4000 Wire Bond Shear / Pull Tester • Ando AQ6317C Spectrum Analyzer • Loomis LSD-100 Scriber / Cleaver • Tektronix CSA 8000 Signal Analyzer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/593949_Ver8.0.0.9_Heller_oven-software-log-1.pdf
: Production capacity option was always displaying 0 - Closed loop N2 with Standby: write Alarm1 value for all three channels. - Belt stop on a digital input signal
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