0.5M automatic inspection pcb conveyor and PCB Belt Conveyor|PCB transfer conveyor used for equipment linking, visual inspection, manual assembly, and PCB buffering functions https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/179.htm
0.5M automatic inspection pcb conveyor and PCB Belt Conveyor|PCB transfer conveyor used for equipment linking, visual inspection, manual assembly, and PCB buffering functions https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/179.htm
PCB shuttle conveyor/PCB traverser/shuttle traverser Conveyor/PCB conveyorhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/126.html the automatic PCB shuttle conveyor is used to connect dual lane with single lane equipment in the p
PCB shuttle conveyor/PCB traverser/shuttle traverser Conveyor/PCB conveyorhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/126.html the automatic PCB shuttle conveyor is used to connect dual lane with single lane equipment in the p
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
New Equipment | Board Handling - Conveyors
PCB rotational transport used to redirect PCBs flow into different channels in a production line(rotate 90 degrees, 180 degrees, 270 degrees). PCB rotating transporter features: 1.Enclosed design with built-in torque limiter ensures h
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
Technical Library | 2015-04-30 20:17:03.0
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
Technical Library | 2011-02-10 16:14:34.0
In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz.
