Industry News | 2012-12-12 12:36:52.0
InvenSense today announced that its 3rd NF-Shuttle, that allows 3rd-party developers to build MEMS prototypes on the company’s proprietary MEMS fabrication process, is scheduled to launch on January 7. The company also announced it is now taking orders for its 4th NF-Shuttle, which is slated to launch in May 2013. NF-Shuttle designs are fabricated on the same NF Platform that produced several hundred million inertial MEMS units for InvenSense.
Industry News | 2009-10-09 23:00:07.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature MICRONOX® MX2302 wafer-level cleaning solution in booth 1022 at the upcoming IMAPS 42nd International Symposium on Microelectronics, scheduled to take place November 3-5, 2009 at the San Jose Convention Center in San Jose, CA.
Industry News | 2010-09-26 15:55:34.0
The International PV Equipment Association (IPVEA), an independent, non-profit organization of manufacturers and suppliers of photovoltaic (PV) fabrication equipment and related raw materials, announces that it jointly organized the PV Production Forum 2010, with the European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC).
Industry News | 2011-09-28 12:26:59.0
BTU International introduces the TRITAN™ HV90 metallization firing system for silicon photovoltaics.
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Industry News | 2019-11-25 11:02:32.0
SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.
Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
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