Technical Library | 1999-08-05 10:45:36.0
In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards.
One of the major suppliers of silicon wafers, and also passive components including NTC chip thermistor (with world top share), surge protectors, EMI filters and SMD antennas suitable for GPS, Bluetooth, Wireless LAN. Also making Langasite wafers.
Supplying full range of the wafer shipper from 150mm to 300mm for both silicon wafer and solar wafer; wafer's foam and wafer's separator
Optical polishing, edge polishing, dicing, flat lapping and machining of all hard materials including ceramic substrates, quartz, AlN, glass and sapphire windows, silicon wafers and very thin substrates and windows.
We produce 2�, 3�, 4�, 5� and 6� silicon ingots and wafers Boron, Phosphorus, Arsenic and Antimony doped for Microelectronics and 4�, 5�, 6� and 6,5� round and pseudosquare ingots for Solar application.
wafer-handling and chamber components
Silicon wafer-level packaging systems for storing and shipping integrated circuits for the semiconductor industry for 75mm 100mm 150mm 200mm 300mm and even square solar solutions. Plastic packaging jars antistatic and conductive foam liners cushions,
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all rema
