Item Description Material : Tinplate, Nickel silver ,etc... Shield type :one piece ,two piece (frame and cover),shield clip Dimension: As your drawing Tolerance: +/-0.05mm ,If you have higher require please advise Process: Stamping ,plating if n
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman
Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.
Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan
Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2021-01-21 08:09:52.0
Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.
Parts & Supplies | SMT Equipment
We are supplying the following Siemens parts: 00350588-04, 00350588, Sleeve with ball fixed. 00351498-03, 00351498, Plunger SP12 00351500-03, 00351500, Plunger SP6 03037984-02, 03037984, VACUUM PLATE COMPL. GLM/R-lightbeige 00354244-01, 0035424
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
| https://www.eptac.com/faqs/ask-helena-leo/ask/darkened-smt-capacitor-or-resistor-terminations-after-leadfree-soldering-reflow
. If it is the entire joint, I would look at the activity of the flux and whether or not the fluxes have changed and the vapors from the flux during the reflow operation are tarnishing the metal surfaces
Imagineering, Inc. | https://www.pcbnet.com/quote/china-fab-quote/
* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" ENIG2U" ENIG3U" ENIG4U" ENIG5U" Immersion Tin Immersion Silver HASL (Leaded
